IC, that is, integrated circuits, have been in existence for 70 years since the first transistor in 1947. More than half a century of development has propelled the path to modern intelligence. IC mainly consists of three parts, electronic components, substrates, packaging tube shell. What we are talking about today is the other two major categories besides the electrical components - the substrate and the package case.
The concern with these two pieces has always been that electronic components are not high, probably because packaging and substrates appear to be very technical, but we may have overlooked the essence.
Integrated circuit, as its name implies, is to be integrated. Many people used to live in rural areas when they were young. At that time, the main part of the house probably consisted of three or two bungalows that functioned as bedrooms. A small courtyard at the entrance placed a table and chairs to serve as a living room with a curling smoke next to it The small house, which is the kitchen, and the toilet with unique features, need some isolation, it is possible in the back of the house, to go on a dozen meters ... Later, to the city, or rural urbanization, we all live A building or suite, a suite inside, with living room, bedroom, kitchen, bathroom, balcony, perhaps only a few dozen square meters, but with the original covers an area of several hundred square meters of rural housing various functions, which is integrated. Integrated circuit is more than this exaggeration, and its integration is far from a suite can be compared, perhaps with a modern building can be better analogy: on the ground there are shops, offices, canteens, hotel apartments, there are several floors underground parking Ground, car park below the foundation - this is the layout of integrated circuits.
The package and the substrate is equivalent to the entire building frame, this is the hard standard to determine the size of the IC area. At present, there are only three kinds of government materials for packaging and substrate: plastic, metal, industrial ceramics. What we want to talk about today is industrial ceramics.
Ceramic substrates and ceramic packaging relative to the other two materials in terms of a rising star, but the waves pushed the waves after the former wave of death on the beach. The popularization and application of industrial ceramics are much faster than that of plastics and metals. Industrial ceramics have unique advantages both in substrate and in packaging.
Now that the power of electronic equipment is moving in the direction of not having the largest and only larger, then the heat dissipation must be the first to bear the brunt of the problem. If the problem of heat dissipation is not solved, all the ideas can only be written on paper. For heat dissipation, the industrial ceramic is The king of the field, whether metal or plastic substrate, thermal conductivity in single digits, while the ceramic substrate, you can achieve the thermal conductivity of 170-230.
From the thermal expansion coefficient point of view, the ceramic substrate will be more close to silicon, the temperature changes occur in volume with the basic electronic components, will not lead to thermal expansion and contraction problems. In the field of communications, the dielectric constant of industrial ceramics is very small, the relative dielectric loss is very small, and in the upcoming 5G, will bring the communication field of ceramic substrate fanaticism.
In the field of packaging, the application of ceramic package slightly wider than the ceramic substrate, such as COB, CDIP, CQFP, etc., but the domestic is not very much on this one, leading to the large-scale LED export 2017 recall. Whether it is LED, the same is true in other areas, we must guarantee the quality, good foundation, to build skyscrapers.
IC is a very large piece, as for the future of industrial ceramic materials can not be a killer, or replace the other two materials, it is unknown. However, ceramics in the IC industry, will dominate.
